PCB Manufacturing Capabilities

We are committed to providing the highest-quality circuit boards in the industry. To ensure this , we maintain a variety of certications.

PCB Capabilities

  • PCB Board Attributes
  • Multilayer Capabilities
  • Plating
  • Pad and Hole
  • Drilling
  • HDI / Laser Micro Vias (10)
  • Control Depth Capabilities
  • Fabrication
  • Bevel Capabilities
  • Solder Mask
  • Silk Screen
  • Impedance (Adder)
  • Technology
  • Materials
  • Multilayer Stackup Tolerances
  • Surface Finishes (Adder)
  • Multiple Finishes (Adder)
  • Electrical Test Capabilities
  • Quality

PCB Board Attributes

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Minimum Line Width (Outer/Inner); (1/4 oz base Cu)
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu)
Minimum Line Width (Outer/Inner); (1/2 oz base Cu)0.004″ (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/2 oz base Cu)0.004″ (0.102); +/- 20%
Minimum Line Width (Outer/Inner); (1 oz base Cu)0.004″ (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1 oz base Cu)0.006″ (0.152); +/-20%
Minimum Line Width (Outer/Inner); (2 oz base Cu)0.006″ (0.152); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (2 oz base Cu)0.006″ (0.152); +/-20%
Minimum Line Width (Outer/Inner); (3 oz base Cu)0.008″ (0.203); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (3 oz base Cu)0.008″ (0.203); +/- 20%
Minimum Line Width (Outer/Inner); (4 oz base Cu)0.010″ (0.254); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (4 oz base Cu)0.010″ (0.254); +/- 20%

Multilayer Capabilities

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Min. Thickness ( Inner Core)0.002″
Min.Finish Line Width/Space(1/1 oz) 3.5 /3.5 mil
Inner (H/ H oz) 3/3 mil
Outer 4/4 mil
Impedance Control L/WLower 4.0 mil (+/- 0.4 mil)
Upper 4.1 mil (+/- 10%)
Non-Impedance Control L/W+/- 20%
Min. Annular ring4.0 mil for (general design)
3. 0 mil (for HDI)”
Min. Clearance6. 0 mil
Dielec-Thickness Tolerance(Impedance)
Dielec-Thickness Tolerance(Non-Impedance)No Criteria Restriction Request
ML Board Thickness Tolerance< 20 mil +/- 2 mil (+/-10%)
< 62 mil +/- 3 mil (+/-10%)
> 62 mil +/- 7% (+/-10%)
Layer Registration (Core to Core)< 0.002″
Warpage Tolerance0.7 %
Etch back Specification (Class 3)0.0002″ ~ 0.002″
Internal Etch tolerance+/-20%
External Etch tolerance+/-20%
Layer to Layer Registration – (> 2 layer)+/-0.003″ (0.0762)
Layer to Layer Registration – (2 layer)+/-0.002″(0.0508)
Maximum PWB Thickness (Mil)137
Maximum Number of Layers18
Profile Tolerance (Routed)+/- 0.004″ (0.1016)
Profile Tolerance (Scored)+/-0.005″ (0.127)
Minimum Internal Cut-out Radius0.046″ (1.168)
Smallest BGA footprint pitch – inches (mm)0.032″ (0.800)
I/L Copper to Board Edge (Routed) *20.010″ (0.254)
I/L Copper to Board Edge (Scored) *20.020″ (0.500)
O/L Copper to Board Edge (Routed) *20.008″ (0.203)
O/L Copper to Board Edge (Scored) *20.020″ (0.500)

Plating

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
IPC-6012 Class 2787 µin avg / 709 µin min (Through holes)
IPC-6012 Class 3
Military (MIL-PRF-31032)

Pad and Hole

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Minimum Finished PTH Hole Size
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu)0.008 (0.203)
Component Finished PTH Size Tolerance+/- 0.003″; 0.006″ (0.152)
Press Fit application:1
Via Finished PTH Size Tolerance+/- 0.003″; 0.006″ (0.152)
PTH Locational Tolerance0.003″ (0.076)
Internal Pad Size (Dia. over Drill)0.012″ (0.305)
Internal Anti Size (Dia. over Drill)0.016″ (0.406)
External Pad Size (Dia. over Drill)0.010″ (0.254)

Drilling

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Smallest Mechanical Drill Size0.008″ (0.203)
Tolerance of Drill size+/- 1 mil
Roughness for hole wall< 1.3 mil
Neil Head< 2.0 x(Inner copper thickess)
Drill Quality=IPC-A-600 class 2
Maximum Drill Aspect Ratio (w/ min. drill)8:01
Maximum Micro via Aspect Ratio (Depth: Diameter)
Maximum Hole Size (Drilled)
Maximum Hole Size (Routed)
Thickness:
< 0.020″”
0.031″”
0.062″”
0.093″”
0.125″””		“0.003””
‘0.003″”
‘0.004″”
‘0.008″”
‘0.010″””
NPTH Size Tolerance Range0.004″ (1.102)
NPTH Locational Tolerance0.003″ (0.076)
Non-Plated Hole to Outer Copper Minimum Spacing0.008″ (0.203)
Hole to Inner Copper Minimum Spacing0.016″
Non-Plated Hole to Edge (No Breakout)0.030″ (0.762)
Plated Hole to Edge (No Breakout)0.040″ (1.016)
Back Drilled Vias (High Speed Transitions)NO
Blind/Buried Vias (All Types)

HDI / Laser Micro Vias (10)

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Laser vias smallest
Via aspect ratio
Landing and capture Pad size
Stack vias, Copper filled vias
Laser Drilled Vias

Control Depth Capabilities

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Drill depth Tolerance (Control Depth Drill Depth)+/- 0.005″
Back Drill Dia (Minimum)
Drilled Hole over Finish (Dia)0.010″

Fabrication

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
V-scoreJump score: 200, 300 available Jump Min. length: 0.5″”
Offset Tolerance
Web Thickness Tolerance
Positionn Tolerance		+/-0.005″
Average Web Thickness:
Mininum Web thickness:		1/3 of thickness
1/4 of thickness
Router Bit (Standard)0.093″; 0.062″;
Router Tolerance (dia)+/-0.008″ (Std)
Router plated Slots0.020″
Router Radius (Min)0.031″

Bevel Capabilities

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Bevel Angles ; Depth Tolerance2000, 3000 , 4500 available ; +/-0.005″

Solder Mask

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Min. Solder Mask Dam (Green)0.004″ (0.102)
Registration (+/-) per side0.003″
Mask to Copper clearance0.003″
Peelable Solder maskMin. 0.050″ clearance
Solder mask Via plug w/LPI80% min fill
NPTH holes/side0.005″
Min. Mask defined pad diameter0.005″
Carbon Link
Solder mask Colors:Green (Semi gloss); White (LED); Black, Blue, Red
Solder mask using Laser Direct ImageYes
Non-Conductive Epoxy Via Fill (3)
Conductive Via Fill (10)

Silk Screen

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Inkjet silk screenWhite Only
LPI legend capabilities
Minimum line width0.005″
LPI Legend Min. Line0.003″
Serialization/Bar codeYes
Silk screen clearance Copper pad0.005″

Impedance (Adder)

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Single ended; Differential Edge-coupled ; Differential Broadside-Coupled+/- 10%
Inhouse testingPolar TDR or Microcraft

Technology

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Etch Back; Edge plating; Castellated Holes; Milling;

Materials

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Minimum Dielectric Thickness0.003 (0.076)
Minimum Copper Weight – Inner Layers (oz)0.5
Minimum Starting Copper Weight – Outer Layers (oz)0.025
Maximum Copper Weight – Inner Layers (oz)3
Maximum Starting Copper Weight – Outer Layers (oz)3
Epoxy Glass (140C Tg min)Yes
Epoxy Glass (170C Tg min)Yes
Polyimide Glass (9)Yes
Resin Coated Copper (for HDI)No
GeTek (9)Yes
Isola 408 / Isola 408HRYes
Isola ISpeed(9) / Isola ITera (9)Yes
Hitachi GHA-679G (Theta) (9)Yes
Rogers(9) 4003/4403 Rogers(9) 4350B/4450B Rogers(9) 4533No
Teflons(9) (Rogers 6002, 6010, 5880) Halogen Free Epoxies(9)No
Buried Capacitance (Faradflex)No
Aluminum MCBYes

Multilayer Stackup Tolerances

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Thickness:
<0.020″”
0.031″”
0.062″”
0.093″”
0.125″”		STANDARD +/-0.005″” SPECIAL +/-0.003″”
STANDARD +/-0.005″” SPECIAL +/-0.003″”
STANDARD +/-0.006″” SPECIAL +/-0.003″”
STANDARD +/-0.009″” SPECIAL +/-0.006″”
STANDARD +/-0.012″” SPECIAL +/-0.009″””

Surface Finishes (Adder)

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
Lead-free HASL; HASL (10)Coverage and solderable (30-1000μin)
C: SN100C; (HASL): RoHS
S: IPC-6012
Electroless Nickel Immersion Gold (ENIG)Def. Range: Ni:118μin min / Au:2-5μin
C: Uyumerra
S: IPC-4552
Eless Nickel Eless Palladium Imm Gold (ENEPIG) (10)Ni:118μin min / Pd:2-5μin / Au:1-2μin
V: Superior Processing
S: IPC-4552 (Ni/Au), ASTM-B-679 (Pd)
Hard Gold (10)v Flash Au: 5-15μin/Contact pads: 30μin
V: Superior Processing
S: ASTM-B-488
Hard Gold (Tabs)Default Range: Ni:118μin min / Au:30μin
S: ASTM-B-488
Soft Bondable Gold (10)Range: Ni:118μin min / Au:50μin min
V: Superior Processing
Immersion SilverRange: 6 – 18μin
C: Uyumerra Silver
S: IPC-4553
Mix Finishes (ENIG and Soft Gold)Yes

Multiple Finishes (Adder)

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
HASL with selective goldYes
ENIG w/ Au fingersYes
Recessed FingersYes

Electrical Test Capabilities

Capabilities AttributesStandard Capabilities Inch (mm); Tolerance
TDR Test Tolerances0.1
HiPot Test (AC/DC) (10)Yes
Min. Test Continuity0.1 Ohms
Max. Test Voltage500 V
Max. Test Isolated resistance25 Mohm-2Gohm
Fixture (Pad size)0.020″
Flying Probe (pad size:)0.010″

Quality

IPC-6012 Class 1
IPC-6012 Class 2
IPC-6012 Class 3 (High Reliability)
IPC-6012 Class 3A (Space & Military Avionics)
Quality Reports
AS 9100 report (Full FAIR)Complete FAIR report with Form 1: Part Number Accountability and Form 3: Characteristic Accountability, Verification and Compatibility Evaluation. Material C of C are included
FAI Report (Partial)Partial FAIR; Form 3: Characteristic Accountability, Verification and Compatibility Evaluation without NC; Material C of C are NOT included
Cross-section report (IPC 9241)Failure analysis (Outside Service):
– Optical inspection and documentation with Real time, high resolution x-ray inspection.
– Cross-sectioning per IPC 9241, Optical and SEM imaging and documentation, Formal, final report
Cross-section report (Inhouse)Measurements only;
– Hole Cu thickness
– Surface Cu Thickness
– Thermal Stress @ 288 +/- 5 C
– Dielectric Thikness
C of C (Std)Material, Final finish, Date code info.
Adv. C of CStd C of C and additional data
– Electrical Test data
– Shipment with Lot # or Date code details
– Product Details
XRF ReportMeasurements
– Average thickness analysis
– Detail Metal thickess analysis
Solderbility ReportTest Method J-Std 003 3.5.1
Thermal Stress ReportIPC-TM-650 2.6.8
Hi Pot TestMeasurements only
TDR report (MOV)Measurements only
Ionic Cont. ReportTest Results only
4 POINT Kevin testMeasurements only
Capacitance reportMeasurements only
Resistance Value reportMeasurements only
  • PCB Board Attributes
  • Multilayer Capabilities
  • Plating
  • Pad and Hole
  • Drilling
  • HDI / Laser Micro Vias (10)
  • Control Depth Capabilities
  • Fabrication
  • Bevel Capabilities
  • Soldar Mask
  • Silk Screen
  • Impedance (Adder)
  • Technology
  • Materials
  • Multilayer Stackup Tolerances
  • Surface Finishes (Adder)
  • Multiple Finishes (Adder)
  • Electrical Test Capabilities
  • Quality

PCB Board Attributes

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Minimum Line Width (Outer/Inner); (1/4 oz base Cu)0.0025″ (0.064); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu)0.003″ (0.076); +/-20%
Minimum Line Width (Outer/Inner); (1/2 oz base Cu)0.004″ (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/2 oz base Cu)0.005″ (0.127); +/-20%
Minimum Line Width (Outer/Inner); (1 oz base Cu)0.005″ (0.127); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1 oz base Cu)0.006″ (0.152); +/-20%
Minimum Line Width (Outer/Inner); (2 oz base Cu)0.006″ (0.152); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (2 oz base Cu)0.007″ (0.178); +/-20%
Minimum Line Width (Outer/Inner); (3 oz base Cu)0.008″ (0.203); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (3 oz base Cu)0.009″ (0.228); +/-20%
Minimum Line Width (Outer/Inner); (4 oz base Cu)0.011″ (0.279); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (4 oz base Cu)0.013″ (0.330); +/-20%

Multilayer Capabilities

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Min. Thickness ( Inner Core)
Min.Finish Line Width/Space
Impedance Control L/W
Non-Impedance Control L/W
Min. Annular ring
Min. Clearance
Dielec-Thickness Tolerance(Impedance)
Dielec-Thickness Tolerance(Non-Impedance)
ML Board Thickness Tolerance
Layer Registration (Core to Core)
Warpage Tolerance
Etch back Specification (Class 3)
Internal Etch tolerance+/-20%
External Etch tolerance+/-20%
Layer to Layer Registration – (> 2 layer)
Layer to Layer Registration – (2 layer)
Maximum PWB Thickness (Mil)210
Maximum Number of Layers24
Profile Tolerance (Routed)+/- 0.004″ (0.1016)
Profile Tolerance (Scored)+/-0.005″ (0.127)
Minimum Internal Cut-out Radius0.032″ (0.813)
Smallest BGA footprint pitch – inches (mm)0.020″ (0.500)
I/L Copper to Board Edge (Routed) *20.007″ (0.178)
I/L Copper to Board Edge (Scored) *20.015″ (0.381)
O/L Copper to Board Edge (Routed) *20.005″ (0.127)
O/L Copper to Board Edge (Scored) *20.012″ (0.305)

Plating

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
IPC-6012 Class 2
IPC-6012 Class 3984 µin avg / 787µin min (Through holes)
Military (MIL-PRF-31032)1000 µin min (Through holes)

Pad and Hole

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Minimum Finished PTH Hole Size
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu)0.005″ (0.127)
Component Finished PTH Size Tolerance+/- 0.002″; 0.004″ (0.102)
Press Fit application+/- 0.002″
Via Finished PTH Size Tolerance+/- 0.002″; 0.004″ (0.102)
PTH Locational ToleranceN/A
Internal Pad Size (Dia. over Drill)0.008″ (0.203)
Internal Anti Size (Dia. over Drill)0.012″ (0.305)
External Pad Size (Dia. over Drill)0.006″ (0.152)

Drilling

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Smallest Mechanical Drill Size0.006″ or less
Tolerance of Drill size
Roughness for hole wall
Neil Head
Drill Quality
Maximum Drill Aspect Ratio (w/ min. drill)
12:1
Maximum Micro via Aspect Ratio (Depth: Diameter)
Maximum Hole Size (Drilled)
Maximum Hole Size (Routed)
Thickness:
< 0.020″”
0.031″”
0.062″”
0.093″”
0.125″””
NPTH Size Tolerance Range
NPTH Locational Tolerance
Non-Plated Hole to Outer Copper Minimum Spacing
Hole to Inner Copper Minimum Spacing
Non-Plated Hole to Edge (No Breakout)
Plated Hole to Edge (No Breakout)
Back Drilled Vias (High Speed Transitions)
Blind/Buried Vias (All Types)Yes

HDI / Laser Micro Vias (10)

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Laser vias smallest0.004″ (0.1016)
Via aspect ratio1:1
Landing and capture Pad sizevia + 0.008″
Stack vias, Copper filled viasYes
Laser Drilled ViasYes (Outside service)

Control Depth Capabilities

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Drill depth Tolerance (Control Depth Drill Depth)
Back Drill Dia (Minimum)0.014″
Drilled Hole over Finish (Dia)

Fabrication

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
V-score
Offset Tolerance
Web Thickness Tolerance
Positionn Tolerance
Average Web Thickness:
Mininum Web thickness:
Router Bit (Standard)
Router Tolerance (dia)+/-0.003″
Router plated Slots0.008″ (Min)
Router Radius (Min)0.0105″

Bevel Capabilities

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Bevel Angles ; Depth Tolerance

Soldar Mask

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Min. Solder Mask Dam (Green)0.003″ (0.076)
Registration (+/-) per side0.0025″
Mask to Copper clearanceMin. 0.002″ (LDI)
Peelable Solder maskMin. 0.040″
Solder mask Via plug w/LPI
NPTH holes/side
Min. Mask defined pad diameter
Carbon LinkYes
Solder mask Colors:Any custom color
Solder mask using Laser Direct Image
Non-Conductive Epoxy Via Fill (3)Yes
Conductive Via Fill (10)Yes

Silk Screen

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Inkjet silk screen
LPI legend capabilitiesBlack, Yellow, Red, Blue
Minimum line width
LPI Legend Min. Line
Serialization/Bar code
Silk screen clearance Copper pad

Impedance (Adder)

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Single ended; Differential Edge-coupled ; Differential Broadside-Coupled
Inhouse testing

Technology

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Etch Back; Edge plating; Castellated Holes; Milling;Yes

Materials

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Minimum Dielectric Thickness0.0025″ (0.064)
Minimum Copper Weight – Inner Layers (oz)0.25
Minimum Starting Copper Weight – Outer Layers (oz)0.25
Maximum Copper Weight – Inner Layers (oz)4
Maximum Starting Copper Weight – Outer Layers (oz)5
Epoxy Glass (140C Tg min)Yes
Epoxy Glass (170C Tg min)Yes
Polyimide Glass (9)Yes
Resin Coated Copper (for HDI)
GeTek (9)No
Isola 408 / Isola 408HRYes
Isola ISpeed(9) / Isola ITera (9)Yes
Hitachi GHA-679G (Theta) (9)Yes
Rogers(9) 4003/4403 Rogers(9) 4350B/4450B Rogers(9) 4533Yes
Teflons(9) (Rogers 6002, 6010, 5880) Halogen Free Epoxies(9)Yes
Buried Capacitance (Faradflex)Yes
Aluminum MCBYes

Multilayer Stackup Tolerances

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Thickness:
<0.020″”
0.031″”
0.062″”
0.093″”
0.125″”

Surface Finishes (Adder)

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
Lead-free HASL; HASL (10)
Electroless Nickel Immersion Gold (ENIG)
Eless Nickel Eless Palladium Imm Gold (ENEPIG) (10)
Hard Gold (10)
Hard Gold (Tabs)
Soft Bondable Gold (10)
Immersion Silver
Mix Finishes (ENIG and Soft Gold)

Multiple Finishes (Adder)

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
HASL with selective goldYes
ENIG w/ Au fingersYes
Recessed FingersYes

Electrical Test Capabilities

Capabilities AttributesExtended Capabilities Inch (mm); Tolerance
TDR Test Tolerances0.05
HiPot Test (AC/DC) (10)
Min. Test Continuity
Max. Test Voltage
Max. Test Isolated resistance
Fixture (Pad size)
Flying Probe (pad size:)0.008″

Quality

IPC-6012 Class 1
IPC-6012 Class 2
IPC-6012 Class 3 (High Reliability)
IPC-6012 Class 3A (Space & Military Avionics)
Quality Reports
AS 9100 report (Full FAIR)Yes
FAI Report (Partial)Yes
Cross-section report (IPC 9241)Yes
Cross-section report (Inhouse)Yes
C of C (Std)Yes
Adv. C of CYes
XRF ReportYes
Solderbility ReportYes
Thermal Stress ReportYes
Hi Pot TestYes
TDR report (MOV)Yes
Ionic Cont. ReportYes
4 POINT Kevin testYes
Capacitance reportYes
Resistance Value reportYes

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